
It provides engineers the cutting-edge technology in a rapidly changing field. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author facilitates learning about other essential topics, such as area array packages - including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, - and provides an increased understanding of the reliability failure modes of soldered SMT components. Written using a very practical, hands-on approach, "Reflow Soldering Processes and Troubleshooting" provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, "Reflow Soldering Processes and Troubleshooting" will be a strong contender in the continuing skill development market for manufacturing personnel. Lead-Free Soldering Trends of Solder Paste and Flux Technologyįocused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types.Optimizing Reflow Profile via Defect Mechanisms Analysis.Problems Occurred at Assembly Stage and Rework).BGA and CSP Board Level Assembly (including.BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping.


SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack).Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing).Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology).Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering).Introduction to Surface Mount Electronic Packaging Technology.Bibliography Includes bibliographical references and index.
